The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences
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Citation
Articles | Volume XLII-5/W2
https://doi.org/10.5194/isprs-archives-XLII-5-W2-95-2019
https://doi.org/10.5194/isprs-archives-XLII-5-W2-95-2019
20 Sep 2019
 | 20 Sep 2019

PHOTOGRAMMETRIC TECHNOLOGY FOR REMOTE HIGH-PRECISION 3D MONITORING OF CRACKS AND DEFORMATION JOINTS OF BUILDINGS AND CONSTRUCTIONS

A. E. Wojnarowski, A. B. Leonteva, S. V. Tyurin, S. G. Tikhonov, and O. V. Artemeva

Keywords: Photogrammetric Technology, Monitoring of Cracks, Photogrammetric Deformation Marks

Abstract. Monitoring of cracks and deformation joints of buildings and engineering constructions can be performed effectively using contemporary methods of photogrammetry. Our study allowed us to design the technology for such a monitoring. This technology is adapted for use by building operation and building inspection specialists and does not require special knowledge in photogrammetry. The monitoring equipment includes two blocks of photogrammetric deformation marks, a digital camera and processing software. Each block of deformation marks is designed as a plate of 60 by 40 mm size where several dozens of marks are fixed (size of the plate and number of marks may vary). The relative positions of the marks on the plate are determined while block calibration with an accuracy of several microns. While monitoring is performed, two blocks of deformation marks are fixed on both sides of the crack or deformation join. Then marks are photographed. Almost any digital camera is suitable, beginning with smartphone camera and ending with specialized photogrammetric camera. Further processing of collected imagery is performed on the basis of rigorous methods of photogrammetry (specialized software were developed). The processing assumes automatic identification and measurement of marks on digital photographic images with sub-pixel accuracy. Additionally, the photogrammetric calibration and distortion correction are performed for each image. Three-dimensional spatial solution is possible both in the case of single image processing, and in the case of stereopair processing. The dynamics of crack development in three dimensions is determined by the results of several cycles of observations collected over period. Our technology allows to ensure the accuracy of the coordinates and deformations at the level of 0.005–0.020 mm for the photographing distances from 0.1 to 40 m.